| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonding method in which the occurrence of defective resin encapsulation can be prevented. SOLUTION: In this method of manufacturing electronic parts which are constituted by mounting semiconductor chips on a substrate, a die bonding step is performed for mounting the semiconductor chips on a plurality of mounting points of the substrate prior to a resin encapsulation step. When a bad mark is detected from one mounting point as a result of recognizing the mounting points in the die boding step, the mounting point is discriminated as a defective mounting point and a defective chip which is discriminated as defective among the semiconductor chips is mounted on the mounting point. In the encapsulation resin sealing step, consequently, the injecting quantity of the resin used for the encapsulation can be made uniform by eliminating the occurrence of mold cavities in a state where the chips are not mounted and the occurrence of defective resin encapsulation can be prevented by preventing the occurrence of defective injection caused by the quantity fluctuation of the resin.
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