| 摘要 |
PROBLEM TO BE SOLVED: To provide an end point detecting method capable of stably judging the end point of dry etching for boring a contact hole even if an area occupied by a contact at the bottom of the contact hole is varied depending on registration accuracy in a photoengraving process. SOLUTION: A first insulating film 19 is formed on a semiconductor substrate 18, a conductive layer 22 is formed on the first insulating film 19, a second insulating film 23 different in kind from the first insulating film 19 is formed on both the conductive layer 22 and the first insulating film 19, a third insulating film 24 is formed on the second insulating film 23, a mask 25 is formed on the third insulating film 24, and the third insulating film 24 is etched through the mask 25. A contact hole 26 is bored in the third insulating film 24, and the formation end point of the contact hole 26 is detected resting on the second insulating film 23.
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