| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for an electronic component which can realize its miniaturization by electrically connecting an electronic component accommodated in a recess with a metallic circuit layer, and can increase a small package component mounting density and realize its multifunction by mounting another electronic component immediately above the electronic component accommodated in the recess. SOLUTION: In the package for an electronic component having a recess for accommodation of the electronic component such as a semiconductor chip, a thin insulating layer, a metallic circuit layer on the rear side of the insulating layer, holes passed through the insulating layer and electrically-conductive connection terminals above the holes, are provided at the bottom of the recess, and the electronic component accommodated in the recess is electrically connected with the metallic circuit layer. Another electronic component is mounted immediately above the electronic component accommodated in the recess.
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