| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered printed wiring board improved in flame resistance, improved in adhesibility with a conductor circuit, and having a solder resist layer formed with an opening into a desired form. SOLUTION: Concerning the multilayer printed wiring board with which conductor circuits and resin insulating layers are formed successively on a substrate, the solder resist layer is formed on the outermost layer, and the solder resist layer contains P atom containing epoxy resins. |
