发明名称 COPPER-PLATED LAMINATED BOARD
摘要 <p>PROBLEM TO BE SOLVED: To offer a copper-plated laminated board which facilitates piercing with a laser beam to make a hole very easy and is suitable for forming an interlayer junction hole of a small diameter, by improving the surface of a copper foil which is to be the incident plane of a laser beam at the manufacture of a printed circuit board. SOLUTION: A copper-plated laminating board uses an electrolytic copper foil which is subjected to piercing with a laser beam, and the rough surface of the electrolytic copper foil is used as an incident plane of the laser beam.</p>
申请公布号 JP2001291940(A) 申请公布日期 2001.10.19
申请号 JP20000103508 申请日期 2000.04.05
申请人 NIKKO MATERIALS CO LTD 发明人 SAKAMOTO MASARU;KITANO AKITSUGU
分类号 B23K26/00;B23K26/38;B23K101/42;C25D7/06;H05K1/09;H05K3/00;H05K3/38;(IPC1-7):H05K3/00 主分类号 B23K26/00
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