发明名称 |
COPPER-PLATED LAMINATED BOARD |
摘要 |
<p>PROBLEM TO BE SOLVED: To offer a copper-plated laminated board which facilitates piercing with a laser beam to make a hole very easy and is suitable for forming an interlayer junction hole of a small diameter, by improving the surface of a copper foil which is to be the incident plane of a laser beam at the manufacture of a printed circuit board. SOLUTION: A copper-plated laminating board uses an electrolytic copper foil which is subjected to piercing with a laser beam, and the rough surface of the electrolytic copper foil is used as an incident plane of the laser beam.</p> |
申请公布号 |
JP2001291940(A) |
申请公布日期 |
2001.10.19 |
申请号 |
JP20000103508 |
申请日期 |
2000.04.05 |
申请人 |
NIKKO MATERIALS CO LTD |
发明人 |
SAKAMOTO MASARU;KITANO AKITSUGU |
分类号 |
B23K26/00;B23K26/38;B23K101/42;C25D7/06;H05K1/09;H05K3/00;H05K3/38;(IPC1-7):H05K3/00 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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