| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated heat radiating member that has no cracks due to a thermal stress caused by heat-and-cool cycles and low heat resistance and a power semiconductor device. SOLUTION: There is provided a laminated radiating member composed of a heat sink, an insulating substrate bonded on the upper surface of the heat sink and an electrode provided on the upper surface of the insulating substrate. This laminated heat radiating member is manufactured by a method comprising the steps of subjecting a heat sink and/or an insulating substrate to surface treatment in advance to secure wettability of a brazing material or metal as desired, placing ceramic particles subjected to surface treatment to secure wettability of the brazing material or metal in advance in a gap between the heat sink and the insulating substrate, disposing a brazing material on and/or under the ceramic particles, heating the brazing material to a temperature higher than the melting point of the brazing material and melting it, infiltrating the melted brazing material into gaps in the ceramic particles, and allowing to react to manufacture a metal matrix composite material and bonding the heat sink and the insulating substrate via the metal matrix. |
