发明名称 COOLING APPARATUS OF ELECTRONIC CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To cool effectively an electronic circuit board and electronic components and facilitate exchanging work of electronic circuit boards and electronic components. SOLUTION: This cooling apparatus is equipped with a box body 2 like a cage or a cabinet loading at least one electronic circuit board on which a plurality of electronic components are mounted, and at least one cooling device 3 which is installed in the box body 2 and circulates liquid refrigerant 4 through the inside. A heat dissipating member 9 of high thermal conductivity which faces the surface of the circuit board 15 and maintains a prescribed interval to the surface is installed detachably on the circuit board 15. The heat dissipating member 9 is arranged in the vicinity of the cooling device 3.
申请公布号 JP2001291811(A) 申请公布日期 2001.10.19
申请号 JP20000109462 申请日期 2000.04.11
申请人 NEC CORP 发明人 ADACHI MASAYUKI
分类号 H05K7/20;H01L23/36;H01L23/473;(IPC1-7):H01L23/473 主分类号 H05K7/20
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