发明名称 |
Modular semiconductor workpiece processing tool |
摘要 |
The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.
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申请公布号 |
US2001030101(A1) |
申请公布日期 |
2001.10.18 |
申请号 |
US20010810192 |
申请日期 |
2001.03.16 |
申请人 |
BERNER ROBERT W.;WOODRUFF DANIEL J.;SCHMIDT WAYNE J.;COYLE KEVIN W.;ZILA VLADIMIR;LUND WORM |
发明人 |
BERNER ROBERT W.;WOODRUFF DANIEL J.;SCHMIDT WAYNE J.;COYLE KEVIN W.;ZILA VLADIMIR;LUND WORM |
分类号 |
H01L21/677;B65G49/07;C25D7/12;H01L21/00;(IPC1-7):H01L21/00;H01L21/64 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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