发明名称 |
ELIMINATION OF PAD GLAZING FOR AL CMP |
摘要 |
Polishing pad glazing during CMP of Al and Al alloys is eliminated or substantially reduced by utilizing a neutral polishing slurry containing a sufficient amount of a surfactant to prevent agglomeration of the abrasive particles with polishing by-products. Embodiments include CMP an Al or an Al alloy surface employing a slurry containing abrasive Al2O3 particles and about 0.02 to about 5 wt. % of a surfactant to prevent Al2O3 abrasive slurry particles from agglomerating with Al(OH)3 polishing by-products. Embodiments further include subsequent ex situ pad conditioning using an acid or base to dissolve, or a complexing agent to remove, Al(OH)3 polishing by-products.
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申请公布号 |
US2001031558(A1) |
申请公布日期 |
2001.10.18 |
申请号 |
US19990421452 |
申请日期 |
1999.10.19 |
申请人 |
SUN LIZHONG;LI SHIJIAN;REDEKER FRED C. |
发明人 |
SUN LIZHONG;LI SHIJIAN;REDEKER FRED C. |
分类号 |
B24B37/00;B24B37/04;B24B53/007;C09G1/02;C09K3/14;H01L21/304;H01L21/321;(IPC1-7):H01L21/302;H01L21/461 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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