发明名称 |
High temp. resistant solder connection enabling mechanically stable, elastically deformable connection of semiconducting body to cooling body |
摘要 |
The solder connection has a metal coating (7) of copper or nickel between a semiconducting body (1) and a connected cooling body (11). The metal coating has a foam-like linked structure with hollow spaces (9) enclosed by dividing walls that extend without interruption between the semiconducting body and the cooling body.
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申请公布号 |
DE10015962(A1) |
申请公布日期 |
2001.10.18 |
申请号 |
DE2000115962 |
申请日期 |
2000.03.30 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
HUEBNER, HOLGER |
分类号 |
B23K1/00;H01L23/373;H01L23/42;(IPC1-7):H01L21/58;H05K7/20;H01L23/12;H01L23/36 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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