AROMATIC OLIGOMER, PHENOLIC RESIN COMPOSITION CONTAINING THE SAME, AND EPOXY RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM

摘要

An aromatic oligomer useful as, e.g., a modifier for epoxy resin compositions; a phenolic resin composition containing the oligomer; and an epoxy resin composition useful for the sealing of electrical/electronic parts and as a circuit board material, etc. The aromatic oligomer is one which is obtained by polymerizing monomers consisting mainly of one or more aromatic olefins comprising at least 20 wt.% acenaphthylene and has a softening point of 80 to 250 DEG C. The phenolic resin composition and epoxy resin composition are obtained by incorporating 3 to 200 parts by weight of the aromatic oligomer into 100 parts by weight of a phenolic resin and an epoxy resin, respectively. The cured epoxy resin is obtained by curing the epoxy resin composition.