| 摘要 |
<p>A method of manufacturing a chip inductor, comprising the conductive layer forming step of forming a conductive layer (4) on the outer peripheral surfaces (2) and end surfaces (3) of a substrate (1), the coil part forming step of forming a coil part (7) having conductive parts (5) and grooved parts (6) by grooving the conductive layer (4) in coil shape, the etching step of etching the substrate (1) having the coil part (7) formed thereon, the insulation resin coating step of forming an exterior part (8) by covering the conductive layer (4) with an insulation resin (13), and the electrode forming step of forming an electrode part (9) at both end parts of the coil part (7) and electrically connecting the electrode part (9) and the conductive layer (4), wherein, in the insulation resin covering step, the insulation resin layer (8) is formed by an electrodepositing method, whereby a chip inductor capable of making flat the installation surface of the exterior part and surely installing a substrate can be manufactured.</p> |
