REMOVABLE HEAT TRANSFER APPARATUS FOR A PIN GRID ARRAY (PGA) DEV ICE

摘要

A heat transfer apparatus (5) is described for coupling to a pin grid array (PGA) device (52) including an integrated circuit (60) and mounted within a socket (54). The socket (54) is mounted upon a surface of a printed circuit board (PCB) (68) and includes two latching projections (100). The heat transfer apparatus (50) includes a thermally conductive heat sink (56) and a spring clip (58) for holding the heat sink (56) in position. The heat sink (56) has an opening for housing the PGA device (52) and the socket (54). The heat sink (56) also has a lip for thermally coupling to the PCB (68). The heat sink (56) also has a pair of holes (65) extending through the heat sink (56) into the opening. The spring clip (58) has two side members (90) each adapted for attaching to a different one of the latching projections (100) of the socket (54). Each of holes (65) in the heat sink (56) is positioned to receive a different one of the side members (90).