CONDITIONER AND CONDITIONING PROCESS FOR POLISHING PAD OF CHEMICAL MECHANICAL POLISHING APPARATUS

摘要

It is described that conditioner and conditioning process for polishing pad which has a various kind, property and state in chemical mechanical polishing. Conditioner moves up and down by a pneumatic mechanism independently. It is installed directly in polishing head and it has an annular type. In addition, it is run in-situ. Therefore, it can increase a surface roughness of polishing pad effectively. It can condition effectively a polishing pad by an increasing pressure. As a result, it warrants a repeatability of a polishing speed by raising a life and characteristic of a polishing pad and it is expected that all of pad surface is uniform.