An offset type grinding stone comprising a metallic circular base plate which is centrally formed with a recess having an attaching hole for attachment to an electrically powered tool and which is integrally formed, continuously in the direction of the front outer periphery of the recess, with a stone section consisting of a single layer of either diamond abrasive grains or cBN abrasive grains, wherein the grinding stone in which the concentration of the abrasive grains of the stone section is set higher in the region of the end associated with the outer peripheral direction and lower in the other region has superior stone life while simultaneously achieving a superior grinding speed and a good flat-grinding ability.
