| 摘要 |
PURPOSE: To provide a mounting structure which realizes a low on-resistance by breaking down the mounting structure of a power MOSFET and is suitable for a mass-production in the present condition that such a demand is strong that a mobile terminal is miniaturized and lightened, and a use lifetime of an integral battery is prolonged. CONSTITUTION: This mounting structure is constituted by a lower frame 4 having a header 2 for sticking a semiconductor chip 1 and its external leads 3d, 3g; the semiconductor chip 1 stuck to the header 2; an upper frame having an abutment electrode stuck to a current passing electrode 5 formed on an upper face of the semiconductor chip 1 and its external lead; and a mold resin 8, thereby mass-producing a two-sheet frame to realize the mounting structure having an extremely low on-resistance. |
