SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A stacked semiconductor package is provided to improve mounting density and heat release capability by flip-chip bonding a plurality of stacked semiconductor chips. CONSTITUTION: The stacked semiconductor package(101) includes a first semiconductor chip(2) having a plurality of input/output pads and a second semiconductor chip(4) having big sizes compared to the first semiconductor chip and formed on the first semiconductor chip. A plurality of conductive connectors(6) are connected to the input/output pads between the first and second semiconductor chips(2,4) and connected between the input/output pads of the second semiconductor chip(4) and leads(12). A package body(18) is molded to the first and second semiconductor chips(2,4), the conductive connectors(6) and leads(12). At this time, the back sides of the leads(12) are exposed to exterior.