| 摘要 |
PURPOSE: To provide a semiconductor device manufacturing system by which chip position information of assembly discriminated as a fault is read without removing resin of a package, the cause of fault is eliminated quickly, and the manufacturing yield of chips is improved quickly. CONSTITUTION: A replacement address reading device 41 reads out a redundant address from a redundant circuit of a semiconductor device being defective in a test after sealing in a package. A chip position analyzing device 42 estimates a log number, wafer number, and a chip number of the semiconductor device being defective from combination of this redundant address. A fault distribution generating device 32 generates distribution of defective chips in each wafer in a log based on the obtained lot number, wafer number, and chip number. A fault cause estimating device 34 estimates a manufacturing device and a manufacturing process being the cause of fault in a wafer process based on this distribution. |
