A method and an apparatus for producing a semiconductor device

摘要

There is disclosed a method and an apparatus for producing a semiconductor device having a diaphragm in the form of a thin part and an integrated circuit section with electrode on the same substrate, said method comprises a first step of forming a semiconductor layer of a second conduction type over a single-crystal semiconductor substrate of a first conduction type; a second step of forming the integrated circuit section with electrode on the semiconductor layer; a third step of forming the electrode in a scribe line area on the semiconductor layer and electrically connecting the electrode in the scribe line area to the electrode of the integrated circuit section; a fourth step of electrochemically etching predetermined parts of the substrate by transmitting electricity for the electrochemical etching through the electrode in the scribe line area, to form the diaphragm from the semiconductor layer and a fifth step of dicing the substrate into chips along the scribe line area, each of the chips forming the semiconductor device.