Thermally enhanced ball grid array package

摘要

Thermally enhanced electronic package (30) has a first electronic component (32) and a number of discrete connectors (36) bonded to a thermally conductive member (34) having a first coefficient of thermal expansion. The connectors have at least one coefficient of thermal expansion different from the first and have fusible conductors (38) on at least one surface and conductive passageways, the electronic component being electrically connected to the passageways in the members and via them to the fusible conductors.