Removal of organic anti-reflection coatings in integrated circuits

摘要

A method for manufacturing an integrated circuit structure is provided having a semiconductor substrate and depositing a layer to be patterned on the semiconductor substrate. An organic anti-reflection coating is deposited on the layer to be patterned and then an organic photoresist on the anti-reflection coating. The photoresist is patterned and developed to form an opening having side walls and to expose a portion of the anti-reflection coating. The photoresist and the exposed portion of the anti-reflection coating adsorb non-active molecules. A unidirectional electron-ion bombardment causes desorption of non-active molecules that gives access of active molecules to the exposed surface of the anti-reflection coating. Bombardment also causes decomposition of non-active molecules on the exposed surfaces, which produces active atoms. Both processes provide unidirectional removal of the anti-reflection coating without attacking the photoresist side walls and underlying layers.