发明名称 |
Apparatus for testing the integrity of a bond |
摘要 |
Apparatus for testing electrical wire bonds of semiconductor devices includes two unequal length cantilever arms (14a, 14b) on a baseplate (11) and a test head (15) at the free end of the arms. The arrangement ensures substantially frictionless straight line movement of a test hook (32) on the text head over the range of deflection expected. A pneumatic or magnetic (21, 22) frictionaless damper is disclosed. The test hook (32) may be orientated by a stepper motor (35) of the test head.
|
申请公布号 |
US6301971(B1) |
申请公布日期 |
2001.10.16 |
申请号 |
US19980196832 |
申请日期 |
1998.11.20 |
申请人 |
DAGE PRECISION INDUSTRIES, INC. |
发明人 |
SYKES ROBERT |
分类号 |
G01L1/00;G01N3/00;G01N19/04;(IPC1-7):G01N3/08 |
主分类号 |
G01L1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|