发明名称 DEVICE FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To change a set flow rate with a simple and inexpensive constitution while supplying a treating solution with a set constant flow rate. SOLUTION: Reagent solutions are allowed to flow into a water supplying pipe 14 through reagent solution supplying pipes 28a to 28c which are connected to the water supplying pipe 14 while supplying pure water to a treating tank 12 provided at a substrate treating section through the supplying pipe 14. A flow rate-controlling valve 20 is interposed in the supplying pipe 14 in order to keep the flow rate. A flow rate-controlling valve capable of setting the flow rate of the treating solution to a constant flow rate corresponding to a pilot pressure is used as the flow rate-controlling valve 20. In a supplying system of the pilot pressure, a pilot pipe 30 connected to a compressor is provided, and parallel branching parts 32a and 32b are provided on the way of the pilot pipe 30 and further, regulators 34a and 34b, pressure gauges 36a and 36b and opening/closing valves 38a and 38b are each interposed to each of the branching parts 32a and 32b, and the values of pressure to be reduced by the regulators 34a and 34b are set to be different to each other.
申请公布号 JP2001286836(A) 申请公布日期 2001.10.16
申请号 JP20000106517 申请日期 2000.04.07
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 MAEKAWA NAOTADA;SUGIMOTO KENJI;ARAI KENICHIRO
分类号 B08B3/08;H01L21/304;H01L21/306;(IPC1-7):B08B3/08 主分类号 B08B3/08
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