| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning fluid used to efficiently remove adhering fine dust and organic matter from the surface of an electronic component while preventing silicon and metals other than silicon from being attacked. SOLUTION: Provided is a cleaning solution for an electronic component, containing a hydroxide, water, a metal corrosion inhibitor, and compounds represented by the formulae: HO-((EO)x-(PO)y)z-H (wherein EO is an oxyethylene group; PO is an oxypropylene group; x and y are integers satisfying the relationships: x/(x+y)=0.05-0.4; and z is a positive integer) and/or R-[((EO)x-(PO)y)z-H]m (wherein EO, PO, x, y, and z are as defined above; R is a residue derived by removing a hydroxylic hydrogen group from an alcohol, a residue derived by removing an aminic hydrogen atom from a hydroxy- containing amine, or a residue derived by removing an aminic hydrogen atom from an amine; and m is an integer of 1 or greater).
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