COPPER-CLAD LAMINATED SUBSTRATE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a copper-clad laminated substrate which has a predetermined thickness and a predetermined precision of thickness obtainable in an easy way without generating a bubble and shows an excellent dielectric property and to provide its manufacturing method. SOLUTION: A copper-clad laminated substrate is provided with a plate- shaped formed item 1 formed by using a thermoplastic resin and copper foils 2 laminated on both surfaces of the plate-shaped formed item 1, wherein the lamination surface 3 of each copper foil 2 is subjected to surface roughening treatment and is bonded to each of both surfaces of the plate-shaped formed item without an adhesive layer between them. A dielectric property of the base material can be enhanced since the copper foil 2 is directly bonded to the plate-shaped formed item 1 formed in a high precision to eliminate use of a reinforcement such as a glass cloth or the like which deteriorates the dielectric property.