POLISHING MEMBER, POLISHING MACHINE, ADJUSTING METHOD, MEASURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To solve the problems that a transparent member with a different material from that of the polishing member needs to be disposed on a portion as a window because a polishing pad is not transparent in general, in forming a measuring window on the polishing member for optical measurement to measure remaining film thickness in a CMP apparatus, and that there is a high risk of a difference in a polishing speed, uneven polishing, and generation of damage because the material generally has different mechanical properties from the polishing member. SOLUTION: This polishing member for polishing machine polishes a polishing object by relatively moving the polishing member and the polishing object with the polishing liquid intervened between the polishing member and the polishing object. A measuring window plate for optically measuring the polishing surface of the polishing object is fitted into the polishing member, an interval between the uppermost front surface of the polishing member and the surface of the uppermost front surface side of the window plate in an unloaded time is set larger than the amount of compressive deformation of the polishing member, and permeability of a measuring beam is adjusted to 10% or more.