发明名称 |
Pack designed to take, in particular, an electrical and/or electronic board, method for the manufacture and assembly of a system comprising a corresponding pack and board |
摘要 |
A pack houses an electrical and/or electronic board. The pack includes positioning structures that support the board. At least one of the positioning structures provides an electrically conductive path to an element located on the board, and has elastic properties that assist the positioning structure to maintain mechanical and electrical contact with the element.
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申请公布号 |
US6303855(B1) |
申请公布日期 |
2001.10.16 |
申请号 |
US19990464980 |
申请日期 |
1999.12.16 |
申请人 |
AVAYA TECHNOLOGY CORP. |
发明人 |
JAN MARC |
分类号 |
H05K7/14;H05K9/00;(IPC1-7):H05K9/00 |
主分类号 |
H05K7/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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