发明名称 |
Method and system for providing electrical insulation for local interconnect in a logic circuit |
摘要 |
The present invention provides a method and system for providing electrical insulation for local interconnect in a logic circuit. A system and method according to the present invention for providing electrical installation for local interconnects during manufacturing of a logic circuit comprising the steps of providing a first layer of material over a semiconductor wafer and providing a second layer of material over the first layer. Additionally, a photoresist material is provided over a portion of the logic circuit to be electrically insulated. Portions of the first and second layers which are unprotected by the photoresist material are then etched. At least a third layer is then provided over the first and second layers, and the third layer is etched such that the first layer as an electrical insulation over the portion of the logic circuit.
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申请公布号 |
US6303949(B2) |
申请公布日期 |
2001.10.16 |
申请号 |
US19990262130 |
申请日期 |
1999.03.03 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
EN WILLIAM GEORGE;MEHTA SUNIL;WANG FEI;LOGIE STEWART GORDON |
分类号 |
H01L21/60;H01L21/768;(IPC1-7):H01L27/10;H01L29/76;H01L23/48 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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