Placement of conductive stripes in electronic circuits to satisfy metal density requirements

摘要

An electronic circuit and a method of designing the electronic circuit having conductive fill stripes which are electrically attached to the power distribution or to the signal routing of the circuit. Preferably, the conductive fill stripes are electrically attached to the power distribution and are interspersed between the power buses and signal wires on the various metal layers to satisfy the metal density requirements of integrated circuit and chip manufacturing. The conductive fill stripes are added during the design process after the placement of the power distribution and signal routing so that electrical continuity between the conductive fill stripes and the connecting bus, metal density requirements, other design rules and logic verification can be completed as the rest of the chip is designed.