ELECTROSTATIC CHUCK DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electrostatic chuck device that will not make a crack or a failure in a buffer layer mounted between an electrostatic chuck and a base and has good heat resistance of the buffer layer and to provide its manufacturing method, too. SOLUTION: The buffer layer in order to offset a difference between a lower insulation layer and the base is mounted between them, which is made of an aluminum-based composite material reduced gradually in ceramics content such that its coefficient of thermal expansion gets gradually higher from an insulation layer side to the base side between the lower electrostatic chuck and the base. The composite material is continuously integrated with an aluminum alloy in the composite material and integrated continuously with the base.