| 摘要 |
PROBLEM TO BE SOLVED: To obtain lead-free new Sn-Cu series solder good in heat resistance, joinability, strength and ductility by improving the conventional Sn-Cu series solder. SOLUTION: This solder has a composition essentially consisting of tin and containing, by weight, <=1% copper, <=0.2% nickel and <=0.1% germanium.
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