| 发明名称 |
SOLDER PASTE |
| 摘要 |
PROBLEM TO BE SOLVED: To prevent the increase in viscosity and deterioration in solderability (reflowing properties) caused by a secular change in solder paste obtained by mixing Sn-Zn series solder and flux. SOLUTION: A glycidyl ether compound is added to flux by the amount of 0.1 to 5.0 mass %.
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| 申请公布号 |
JP2001287081(A) |
申请公布日期 |
2001.10.16 |
| 申请号 |
JP20010023600 |
申请日期 |
2001.01.31 |
| 申请人 |
SENJU METAL IND CO LTD;MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
TAGUCHI NARUTOSHI;TAKAURA KUNIHITO;HIRATA MASAHIKO;YOSHIDA HISAHIKO;NAGASHIMA TAKASHI |
| 分类号 |
B23K35/22;B23K35/26;B23K35/363;H05K3/34;(IPC1-7):B23K35/22 |
主分类号 |
B23K35/22 |
| 代理机构 |
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代理人 |
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