| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition for a cover lay film which excels in peel strength, heat resistance to reflow soldering, and migration characteristics, and a cover lay film for a flexible printed circuit board which uses the adhesive composition. SOLUTION: The adhesive composition for a cover lay film comprises (a) 100 pts.wt. carboxyl group-containing acrylic rubber, (b) 5-50 pts.wt. phenolic resin, (c) 10-90 pts.wt. epoxy resin, and (d) 0.1-10 pts.wt. curing agent, and additionally (e) 0.01-5.0 pts.wt. bisoxazoline as a crosslinking agent of an acrylic rubber, and the cover lay film for a flexible printed circuit board has an adhesive layer composed of the adhesive composition for a cover lay film provided on an electrically insulating film.
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