| 摘要 |
Generally, the invention includes a product for and a method of wafer scale burn-in testing. The product may include a substrate or semiconductor device having a nonplanar surface (multi-layer substrate), an interposer layer over the nonplanar surface and electrical traces on the interposer having raised electrical features for connecting to contact pads on a semiconductor wafer. The interposer layer may take on a variety of configurations and compositions. The interposer layer may be an adhesive layer, or a combination of a flexible layer for supporting the electrical traces and raised features, and a compressible layer. Vias may be provided from the electrical traces down to contact pads on the substrate or device having a nonplanar surface. Alternatively, electrical traces having a first and second raised features extending in opposite directions may be utilized to make a connection between the wafer and the multi-layer substrate.
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