发明名称 |
Via connector and method of making same |
摘要 |
An insulator substrate or printed circuit board (PCB) having a filled and plated via is provided. The plated via is filled with an electrically conductive fill composition. A conductive cap layer is formed on both ends of the conductive fill composition in the via and the major surfaces of the insulator substrate and can be bonded to a surface mount contact as a land or a pad.
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申请公布号 |
US6303881(B1) |
申请公布日期 |
2001.10.16 |
申请号 |
US20000649169 |
申请日期 |
2000.08.25 |
申请人 |
VIASYSTEMS, INC. |
发明人 |
PARKER, JR. JOHN LEROY;MISCIKOWSKI PAMELA L. |
分类号 |
H05K1/11;H05K3/00;H05K3/24;H05K3/40;H05K3/42;(IPC1-7):H01R12/04 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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