Global cluster pre-classification methodology

摘要

A method of detecting and pre-classifying cluster type defects in a process for manufacturing semiconductor wafers. At least one inspection wafer is selected from a set of semiconductor wafers being process and the first layer of the set is processed. The first layer is scanned for defect information and it is determined whether a cluster pattern exists and comparing the cluster pattern to patterns stored in a pattern detection and classification register and pre-classifying the cluster pattern if a cluster pattern is detected and updating a defect database with comparison and pre-classification information for the first layer. Repeating the process for the next layer.