| 发明名称 |
BATCH ASSEMBLY OF HIGH DENSITY HERMETIC PACKAGES FOR POWER SEMICONDUCTOR CHIPS |
| 摘要 |
<p>Batch assembly methods for high density packaging of power semiconductor chi ps (32) in hermetic thin packaging include providing silicon chip arrays with thermocompressively bonded-foil contacts (38), preparing ceramic lid arrays (10) which contain upper surface and lower margin direct-bonded copper coverings (18) and throu gh- the-lid high current spherical conductors (16), coining Cu/Mo/Cu or copper cup arrays (44), die mounting within each respective cup a respective semiconductor chip (32), su- perpositionally registering a lid array (10) with a strip form of cup array, and solder (21) reflowing to hermetically seal as hermet- ic thin packaging within a registered set of cup (44) and lid arrays (10).</ SDOAB></p> |
| 申请公布号 |
CA2080690(C) |
申请公布日期 |
2001.10.16 |
| 申请号 |
CA19912080690 |
申请日期 |
1991.12.20 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
NEUGEBAUER, CONSTANTINE ALOIS;TEMPLE, VICTOR ALBERT KEITH |
| 分类号 |
H01L21/50;H01L21/52;H01L23/04;H01L23/538;(IPC1-7):H01L21/52;H01L21/60 |
主分类号 |
H01L21/50 |
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