| 摘要 |
PROBLEM TO BE SOLVED: To hold an electrical part with a plurality of substantially uniformly distributed solder bumps on the surface, over the surface with the solder bumps, via negative-pressure suction. SOLUTION: An end face 64 surrounding an opening 66 of an air suction hole 68 has recesses 84 at its positions corresponding to a plurality of solder bumps 16, and notches 86 adjoining the recesses 84. That portion of the end face 64 which has no recesses 84 and notches 86 forms a seal portion 92. When an electrical part holder 8 is lowered, the seal portion 92 is brought into contact with a surface 14 of a ball grid array(BGA) part 10, and the solder bumps 16 are housed in the recesses 84. When air is sucked up from the air suction hole 68, the seal portion 92 prevents a negative-pressure leak to cause the negative-pressure suction force to hold the BGA part 10 on the electrical part holder 8. The plurality of recesses 84 are independent of one another, so that even upon a local negative-pressure leak, the other recesses 84 are free from leakage and reduce the negative-pressure leak. |
