| 摘要 |
PROBLEM TO BE SOLVED: To obtain both a low-permittivity resin composition suitable for forming a printed wiring board used for a higher speed and a higher frequency strongly desired for various kinds of electronic equipment such as computers or cellular phones, a printed wiring board responsive to the higher speed and the higher frequency of electronic parts such as IC packages or a solder resist, a layer insulating layer, etc., for the IC packages and a film using the resin composition. SOLUTION: This resin composition is characterized as comprising (A) an epoxy resin having >=2 epoxy groups in one molecule, (B) a curing agent and (C) a powder having <=3.5 permittivity.
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