发明名称 |
Housing assembly for an electronic component |
摘要 |
A housing assembly forms a package for an electronic device. The housing assembly has the electronic device, an external carrier and a housing frame. A capillary-acting epoxy resin is filled into the assembled housing assembly via a filling-in opening and, on account of its capillary action, closes the interspaces between the semiconductor chip and the housing frame. |
申请公布号 |
AU5460901(A) |
申请公布日期 |
2001.10.15 |
申请号 |
AU20010054609 |
申请日期 |
2001.03.28 |
申请人 |
INFINEON TECHNOLOGIES, AG |
发明人 |
REINHARD FISCHBACH;MANFRED FRIES;MANFRED ZAESKE |
分类号 |
H01L23/28;H01L21/56 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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