| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board having a radiation means which efficiently radiate heat generated in an electronic component without enlarging the printed wiring board. SOLUTION: In the printed wiring board, the electronic component having a heat sink for conducting heat generated inside to outside is surface-mounted on the surface of the board. The radiation means for radiating heat is surface- mounted on a position corresponding to the electronic component on the rear side of the board. |
