发明名称 THIN-FILM LAMINATED BOARD, MANUFACTURING METHOD THEREOF, LIQUID-CRYSTAL DEVICE, AND ELECTRONIC APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a manufacturing method for a thin-film laminated board, wherein degradation in performance near a joint part is prevented. SOLUTION: When a tantalum alloy film 27 is formed, a board main body 11a is divided into exposure regions 11A and 11B during an exposure process for split exposure. A joint between the exposure region 11A and the exposure region 11B is assumed as the joint 32. When a chrome film 23 is formed, the board main body 11a is divided into exposure regions 11C and 11D during an exposure process for split exposure. A joint between the exposure region 11C and the exposure region 11D is assumed as the joint 42. The joint position of the joint 32 is different from that of the joint 42.</p>
申请公布号 JP2001284683(A) 申请公布日期 2001.10.12
申请号 JP20000092499 申请日期 2000.03.29
申请人 SEIKO EPSON CORP 发明人 DAIKOU TETSUYA;YAMAGUCHI YOSHIO;TAKANO YASUSHI
分类号 G02F1/136;G02F1/1365;G02F1/1368;G09F9/30;H01L21/336;H01L29/786;H01L49/02;(IPC1-7):H01L49/02 主分类号 G02F1/136
代理机构 代理人
主权项
地址