| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer printed wiring board wherein surface flatness of the board can be improved. SOLUTION: This manufacturing method comprises a process wherein a first metal layer on an insulating board 11 is selectively etched and a plurality of first bumps 21 are formed, a process for forming a first insulating resin layer 31 on the first bumps 21, a process wherein a second metal layer 33 is fixed with pressure on the first insulating resin layer 31 and tips of the first bumps 21 are connected with the second metal layer 33 penetrating the first insulating resin layer 31, a process wherein the second metal layer 33 is selectively etched and a plurality of second bumps 41 are formed, a process for forming a second insulating resin layer on the second bumps 41, and a process wherein a third metal layer is fixed with pressure on the second insulating resin layer and tips of the plurality of second bumps are connected with the facing third metal layer penetrating the second insulating resin layer. |
