| 摘要 |
PROBLEM TO BE SOLVED: To provide an EL element encapsulation method that prevents the quality of the light emitting device from deteriorating and that prevents the performance from reducing by effectively preventing external moisture and oxygen. SOLUTION: In the environment where the moisture/oxygen concentration is controlled, the glass substrate which has the EL element and the corresponding glass cap plate are first provided, and an edge adhesive is coated on the outer peripheral position corresponding to each light emitting element on the substrate on the cap plate, and an opening is installed beforehand on the side face which does not have a circuit of light emitting element outer periphery. After that, the edge adhesive is solidified matching the cap plate with the substrate, and each encapsulation element is formed by progressing forward the cuts for the substrate and dividing each light emitting device, and followingly the encapsulation element is installed in the vacuum vessel and the vessel is evacuated, and when the pressure of the vacuum vessel reaches a set value, the encapsulation elements is put into an adhesive vessel of the bottom of the vacuum vessel and the opening of the encapsulant and an encapsulation material is made to come into contact with the encapsulant. After enhancing the pressure of the vacuum vessel and filling the encapsulant into the hollow by the pressure difference between the inside and the outside of the encaptulation element, the encapsulant is solidified in the hollow part and the prevention of encapsulation of the light emitting device is completed.
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