| 发明名称 |
ELECTRONIC-CIRCUIT FORMATION PRODUCT AND MANUFACTURING METHOD THEREFOR |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic circuit formation product whose shock resistance is superior, which can be reused or the like and which can be packaged in a short time. SOLUTION: Cylindrical or sheetlike thermoplastic films 3, 3A, 3B, 3C are decompressed so as to package a board 1. The board and components 2, 2A are protected. |
| 申请公布号 |
JP2001284779(A) |
申请公布日期 |
2001.10.12 |
| 申请号 |
JP20000090509 |
申请日期 |
2000.03.29 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
MIYAGAWA HIDEKI;MARUYAMA YOSHIO;YAMAUCHI MASARU;NAKADA MIKIYA;AKIGUCHI NAOSHI;WADA YOSHINORI;MORI KAZUHIRO |
| 分类号 |
B65D85/86;H05K3/28;H05K5/06;(IPC1-7):H05K3/28 |
主分类号 |
B65D85/86 |
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