发明名称 METHOD AND DEVICE FOR FORMING COPPER OR Cu CONTAINING FILM
摘要 PROBLEM TO BE SOLVED: To form a Cu film or Cu1-xSix film that can be positively controlled, and is homogeneous with high quality. SOLUTION: This device for forming the Cu film is equipped with a vacuum container 1, a heating/cooling device 2 that is arranged in the vacuum container 1 and supports a Cu plate 4 at one side, a substrate-heating device 3 that is arranged in the vacuum container 1 and supports a substrate 6 at one side while the substrate 6 faces the Cu plate 6, a chlorine gas nozzle 7 that applies a chlorine gas to the Cu plate 6 in the vacuum container 1, a flow rate- controlling device 9 that controls the flow rate of gas from the chlorine gas nozzle 7, and a vacuum exhaust device 10 that carries out evacuation in the vacuum container 1.
申请公布号 JP2001284285(A) 申请公布日期 2001.10.12
申请号 JP20000089695 申请日期 2000.03.28
申请人 MITSUBISHI HEAVY IND LTD 发明人 SAKAMOTO HITOSHI
分类号 C23C16/08;C23C16/46;C23C16/52;H01L21/28;H01L21/285;(IPC1-7):H01L21/285 主分类号 C23C16/08
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