| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable wiring board which can effectively prevent the migration of a metal forming a wiring conductor. SOLUTION: In the wiring board, a plurality of wiring conductors 2 which contain silver, aluminum or an alloy of the metals are installed on the surface of a board 1 side by side at intervals of 10 to 100μm, and the wiring conductors 2 are covered in common with a protective layer 3 which is composed mainly of an epoxy resin. The inside of the protective layer 3 contains benzocyclobutene resin fillers 4 in a particle size of 0.5 to 5.0μm. The content of the fillers 4 is set at 10 to 40 wt.% in regions between the adjacent wiring conductors 2, 2, and the content is set at 8 to 25 wt.% in a region on each wiring conductor 2.
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