| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package in which heat dissipation performance can be enhanced by mounting a large number of semiconductor chips on a lead frame while stacking thereby realizing high function. SOLUTION: The semiconductor package comprises a first semiconductor chip 2 having a large number of I/O pads formed on the upper surface, a second semiconductor chip 4 located on the upper surface of the first semiconductor chip over a larger area and having a large number of I/O pads formed on the lower surface, a large number of leads 12 formed at the outer circumferential edge of the first semiconductor chip and in the lower surface region of the second semiconductor chip, a large number of conductive connection means 6 for interconnecting the I/O pads of the first semiconductor chip with specified I/O pads of the second semiconductor chip and interconnecting other I/O pads of the second semiconductor chip with the leads, and a package body 18 formed to seal the first and second semiconductor chips, the conductive connection means and the leads but to expose the lower surface of the leads to the outside. |
