| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board wherein a large current can be made to flow and high frequency characteristic is improved, and to provide a manufacturing method of the printed wiring board. SOLUTION: A via 60 which is relatively large is formed on an interlayer resin insulating film 40. A plurality of vias 160 which are relatively small and connected with the via 60 are arranged on an interlayer resin insulating film 140. Consequently, a large current can be made to flow. Since the same effect as parallel connection of impedance components can be obtained, high frequency characteristic of wiring is improved, and malfunction of an IC chip can be prevented. |
