| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor chip which can prevent warpage deformation. SOLUTION: A trench 10 is made in setting resin 7, before hardening the setting resin 7 stacked on a wafer 2. Consequently, the stress at the time of hardening and shrinking of the setting resin 7 is offset, and warpage deformation can be prevented in the wafer 2 as a whole. Moreover, the trench 10 is provided in line with a dicing street 9. Dicing work can be performed easily, by providing a chip with the trench 10 in advance in matching with the cutting section. |
